a - 2005 06 - sep. LUG2043-PF ligitek electronics co.,ltd. property of ligitek only LUG2043-PF super bright round type led lamps data sheet doc. no : qw0905- rev. : date : lead-free parts pb
- + 1/5 page LUG2043-PF part no. ligitek electronics co.,ltd. property of ligitek only package dimensions note : 1.all dimension are in millimeter tolerance is 0.25mm unless otherwise noted. 2.specifications are subject to change without notice. directivity radiation 25% 75% 100%50% -60 -30 75% 25% 050%100% 0 30 60 3.0 4.0 5.2 1.5max 4.2 2.54typ 0.5 typ 1.0min 25.0min
water clear color lens algainp material LUG2043-PF part no green emitted 700 luminous intensity @20ma(mcd) typ. 20 spectral halfwidth nm 574 dominant wave length dnm 2.6 max. forward voltage @ ma(v) 1.7 min. 20 350 min. viewing angle 2 1/2 (deg) 30 2/5 page ligitek electronics co.,ltd. property of ligitek only unit ma ma a v mw 30 120 ug ratings 10 2000 ir -40 ~ +85 max 260 for 5 sec max (2mm from body) -40 ~ +100 100 part no. LUG2043-PF forward current peak forward current duty 1/10@10khz parameter operating temperature soldering temperature storage temperature electrostatic discharge reverse current @5v power dissipation typical electrical & optical characteristics (ta=25 ) symbol esd tsol t opr tstg i f pd i fp absolute maximum ratings at ta=25 note : 1.the forward voltage data did not including 0.1v testing tolerance. 2. the luminous intensity data did not including 15% testing tolerance.
3.0 2.5 1.5 1.0 0.5 0.0 2.0 fig.4 relative intensity vs. temperature r e l a t i v e i n t e n s i t y @ 2 0 m a wavelength (nm) 500 0.0 0.5 550600650 ambient temperature( ) fig.5 relative intensity vs. wavelength fig.3 forward voltage vs. temperature f o r w a r d v o l t a g e @ 2 0 m a n o r m a l i z e @ 2 5 1.0 -40 0.8 -20 1.1 1.0 0.9 1.2 r e l a t i v e i n t e n s i t y @ 2 0 m a n o r m a l i z e @ 2 5 20 060 40100 80 100 20 ambient temperature( ) -20 -40 060 4080 typical electro-optical characteristics curve 3.0 2.5 2.0 1.5 1.0 0.5 0.0 ligitek electronics co.,ltd. property of ligitek only fig.2 relative intensity vs. forward current fig.1 forward current vs. forward voltage forward voltage(v) 100 f o r w a r d c u r r e n t ( m a ) 1.0 0.1 1.0 10 ug chip 1000 r e l a t i v e i n t e n s i t y n o r m a l i z e @ 2 0 m a 2.03.0 1000 forward current(ma) 1.010100 4.05.0 part no. LUG2043-PF page 3/5
120 260 time(sec) temp( c) dip soldering preheat: 120 c max preheat time: 60seconds max ramp-up 3 c/sec(max) ramp-down:-5 c/sec(max) solder bath:260 c max dipping time:3 seconds max distance:2mm min(from solder joint to body) 260 c3sec max preheat 2.wave soldering profile soldering condition(pb-free) 1.iron: soldering iron:30w max temperature 350 c max soldering time:3 seconds max(one time) distance:2mm min(from solder joint to body) 60 seconds max 3 /sec max 5 /sec max 25 ligitek electronics co.,ltd. property of ligitek only page 4/5 part no. LUG2043-PF
part no. LUG2043-PF page 5/5 ligitek electronics co.,ltd. property of ligitek only reference standard mil-std-883:1008 jis c 7021: b-10 jis c 7021: b-12 mil-std-750: 1026 mil-std-883: 1005 jis c 7021: b-1 description test condition test item reliability test: 1.ta=105 5 2.t=1000 hrs (-24hrs, +72hrs) the purpose of this is the resistance of the device which is laid under condition of low temperature for hours. 1.ta=-40 5 2.t=1000 hrs (-24hrs, +72hrs) the purpose of this is the resistance of the device which is laid under ondition of high temperature for hours. low temperature storage test high temperature storage test 1.under room temperature 2.if=20ma 3.t=1000 hrs (-24hrs, +72hrs) operating life test this test is conducted for the purpose of detemining the resisance of a part in electrical and themal stressed. mil-std-202:103b jis c 7021: b-11 mil-std-202: 210a mil-std-750: 2031 jis c 7021: a-1 mil-std-202: 107d mil-std-750: 1051 mil-std-883: 1011 mil-std-202: 208d mil-std-750: 2026 mil-std-883: 2003 jis c 7021: a-2 1.ta=65 5 2.rh=90%~95% 3.t=240hrs 2hrs 1.t.sol=260 5 2.dwell time= 10 1sec. 1.ta=105 5 &-40 5 (10min) (10min) 2.total 10 cycles the purpose of this is the resistance of the device to sudden extreme changes in high and low temperature. solder resistance test thermal shock test high temperature high humidity test 1.t.sol=230 5 2.dwell time=5 1sec solderability test this test intended to determine the thermal characteristic resistance of the device to sudden exposures at extreme changes in temperature when soldering the lead wire. the purpose of this test is the resistance of the device under tropical for hous. this test intended to see soldering well performed or not.
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